News

2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena – (CEIDP 2012)

Enpay Insulation Components

The Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) is sponsored by the IEEE Dielectrics and Electrical Insulation Society to provide an international forum for the discussion of current research on electrical insulation, dielectric phenomena and related topics. The conference provides an opportunity for specialists from around the world to meet and to discuss...
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Enpay Starts up a brand-new Transformerboard Machine…

Transformer Board

Enpay started up a state-of-the-art  Transformer board machine in 2009. Boards are characterized by high density, high purity, uniform thickness, dimensional stability, low compressibility, low shrinkage and high electrical strength.  Transformer board produced, a hard and rigid one having high purity with excellent electrical and mechanical properties, is specifically engineered for the high voltage...
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